diff options
author | Harald Welte <laforge@gnumonks.org> | 2018-09-05 12:38:19 +0200 |
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committer | Harald Welte <laforge@gnumonks.org> | 2018-09-05 12:38:19 +0200 |
commit | 3d507d68ef5885cc56bc85f6fc679395006b4f20 (patch) | |
tree | cca6cf7ab15c7ba9e6ce0b75064fcadf8abca35f /sfp-breakout/sfp-breakout.brd | |
parent | 157dfbf79f2f03808af39389c3c82bbcdd931dc1 (diff) |
sfp-breakout: X1 pin 5 missing connection to VCC_3V3
Due to an overisght, pin 5 of the X1 header was missing the intended
connection to the 3V3 plane. Let's fix this. No routing changes on the
PCB required, as this simply connects the VCC plane layer to the
through-hole.
Diffstat (limited to 'sfp-breakout/sfp-breakout.brd')
-rw-r--r-- | sfp-breakout/sfp-breakout.brd | 1 |
1 files changed, 1 insertions, 0 deletions
diff --git a/sfp-breakout/sfp-breakout.brd b/sfp-breakout/sfp-breakout.brd index 59e30c3..4244bdd 100644 --- a/sfp-breakout/sfp-breakout.brd +++ b/sfp-breakout/sfp-breakout.brd @@ -2858,6 +2858,7 @@ for the minimum (VIA) drill of 0.3mm as 0.36mm.</description> <via x="5.08" y="17.78" extent="1-16" drill="0.3"/> <wire x1="11.43" y1="16.9425" x2="11.43" y2="17.78" width="0.4064" layer="1"/> <via x="11.43" y="17.78" extent="1-16" drill="0.3"/> +<contactref element="X1" pad="5"/> </signal> <signal name="TD_P" class="1"> <contactref element="SFP1" pad="18"/> |