smartcard-fpc: add BOM attributes

2 files changed, 40 insertions, 45 deletions

diff --git a/hardware/smartcard-fpc/smartcard-fpc.brd b/hardware/smartcard-fpc/smartcard-fpc.brd
index 8bdad9a..5a2fa6f 100644
--- a/hardware/smartcard-fpc/smartcard-fpc.brd
+++ b/hardware/smartcard-fpc/smartcard-fpc.brd
@@ -9814,60 +9814,52 @@ contribute to osmocom at https://osmocom.org/</text>
 <class number="0" name="default" width="0.6" drill="0">
 </class>
 </classes>
-<designrules name="default *">
-<description language="de">&lt;b&gt;EAGLE Design Rules&lt;/b&gt;
-&lt;p&gt;
-Die Standard-Design-Rules sind so gewählt, dass sie für 
-die meisten Anwendungen passen. Sollte ihre Platine 
-besondere Anforderungen haben, treffen Sie die erforderlichen
-Einstellungen hier und speichern die Design Rules unter 
-einem neuen Namen ab.</description>
-<description language="en">&lt;b&gt;EAGLE Design Rules&lt;/b&gt;
-&lt;p&gt;
-The default Design Rules have been set to cover
-a wide range of applications. Your particular design
-may have different requirements, so please make the
-necessary adjustments and save your customized
-design rules under a new name.</description>
+<designrules name="jlcpcb-2layers *">
+<description language="en">&lt;b&gt;JLCPCB design rules (2 layers)&lt;/b&gt;
+&lt;ul&gt;
+&lt;li&gt;Board thickness: 1.6mm&lt;/li&gt;
+&lt;li&gt;Copper weight: 1oz (35um)&lt;/li&gt;
+&lt;li&gt;Note: annular ring aren't minimal&lt;/li&gt;
+&lt;/ul&gt;</description>
 <param name="layerSetup" value="(1*16)"/>
 <param name="mtCopper" value="0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm"/>
-<param name="mtIsolate" value="0.8mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm"/>
-<param name="mdWireWire" value="10mil"/>
-<param name="mdWirePad" value="10mil"/>
-<param name="mdWireVia" value="10mil"/>
-<param name="mdPadPad" value="8mil"/>
-<param name="mdPadVia" value="8mil"/>
-<param name="mdViaVia" value="8mil"/>
-<param name="mdSmdPad" value="8mil"/>
-<param name="mdSmdVia" value="8mil"/>
-<param name="mdSmdSmd" value="8mil"/>
-<param name="mdViaViaSameLayer" value="8mil"/>
+<param name="mtIsolate" value="1.6mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm"/>
+<param name="mdWireWire" value="5mil"/>
+<param name="mdWirePad" value="5mil"/>
+<param name="mdWireVia" value="5mil"/>
+<param name="mdPadPad" value="5mil"/>
+<param name="mdPadVia" value="5mil"/>
+<param name="mdViaVia" value="5mil"/>
+<param name="mdSmdPad" value="5mil"/>
+<param name="mdSmdVia" value="5mil"/>
+<param name="mdSmdSmd" value="5mil"/>
+<param name="mdViaViaSameLayer" value="6mil"/>
 <param name="mnLayersViaInSmd" value="2"/>
-<param name="mdCopperDimension" value="40mil"/>
-<param name="mdDrill" value="8mil"/>
+<param name="mdCopperDimension" value="0.2mm"/>
+<param name="mdDrill" value="6mil"/>
 <param name="mdSmdStop" value="0mil"/>
-<param name="msWidth" value="10mil"/>
-<param name="msDrill" value="24mil"/>
-<param name="msMicroVia" value="9.99mm"/>
+<param name="msWidth" value="5mil"/>
+<param name="msDrill" value="0.3mm"/>
+<param name="msMicroVia" value="0.3mm"/>
 <param name="msBlindViaRatio" value="0.5"/>
-<param name="rvPadTop" value="0.25"/>
-<param name="rvPadInner" value="0.25"/>
-<param name="rvPadBottom" value="0.25"/>
-<param name="rvViaOuter" value="0.25"/>
-<param name="rvViaInner" value="0.25"/>
-<param name="rvMicroViaOuter" value="0.25"/>
-<param name="rvMicroViaInner" value="0.25"/>
+<param name="rvPadTop" value="0.4"/>
+<param name="rvPadInner" value="0"/>
+<param name="rvPadBottom" value="0.4"/>
+<param name="rvViaOuter" value="0"/>
+<param name="rvViaInner" value="0"/>
+<param name="rvMicroViaOuter" value="0"/>
+<param name="rvMicroViaInner" value="0"/>
 <param name="rlMinPadTop" value="10mil"/>
-<param name="rlMaxPadTop" value="20mil"/>
+<param name="rlMaxPadTop" value="80mil"/>
 <param name="rlMinPadInner" value="10mil"/>
 <param name="rlMaxPadInner" value="20mil"/>
 <param name="rlMinPadBottom" value="10mil"/>
-<param name="rlMaxPadBottom" value="20mil"/>
-<param name="rlMinViaOuter" value="8mil"/>
+<param name="rlMaxPadBottom" value="80mil"/>
+<param name="rlMinViaOuter" value="3mil"/>
 <param name="rlMaxViaOuter" value="20mil"/>
 <param name="rlMinViaInner" value="8mil"/>
 <param name="rlMaxViaInner" value="20mil"/>
-<param name="rlMinMicroViaOuter" value="4mil"/>
+<param name="rlMinMicroViaOuter" value="3mil"/>
 <param name="rlMaxMicroViaOuter" value="20mil"/>
 <param name="rlMinMicroViaInner" value="4mil"/>
 <param name="rlMaxMicroViaInner" value="20mil"/>
@@ -9882,7 +9874,7 @@ design rules under a new name.</description>
 <param name="mlMaxStopFrame" value="4mil"/>
 <param name="mlMinCreamFrame" value="0mil"/>
 <param name="mlMaxCreamFrame" value="0mil"/>
-<param name="mlViaStopLimit" value="0mil"/>
+<param name="mlViaStopLimit" value="0.4mm"/>
 <param name="srRoundness" value="0"/>
 <param name="srMinRoundness" value="0mil"/>
 <param name="srMaxRoundness" value="0mil"/>
@@ -9997,8 +9989,11 @@ design rules under a new name.</description>
 <element name="X1" library="iso7816-card" package="ISO7816_CARD" value="" x="42.8" y="26.75"/>
 <element name="X2" library="laforge" package="FPC_JUSHUO_AFA07-S06" value="FCI_FPC_REBEL_SFW6R-1-JUSHUO-AFA07" x="94.234" y="28.194" smashed="yes" rot="R90">
 <attribute name="NAME" x="99.314" y="36.576" size="1.27" layer="25" font="vector" ratio="14" rot="R180"/>
+<attribute name="LCSC_PART" value="C72727" x="94.234" y="28.194" size="1.4224" layer="27" font="vector" ratio="14" rot="R90" display="off"/>
+</element>
+<element name="C1" library="rc-sysmocom" package="_0603" value="100n" x="90.932" y="24.638" rot="R90">
+<attribute name="LCSC_PART" value="C30926" x="90.932" y="24.638" size="1.4224" layer="27" font="vector" ratio="14" rot="R90" display="off"/>
 </element>
-<element name="C1" library="rc-sysmocom" package="_0603" value="" x="90.932" y="24.638" rot="R90"/>
 <element name="U$1" library="laforge" package="WEEE_BIN_TOP" value="" x="77.724" y="11.43" rot="MR0"/>
 <element name="U$2" library="laforge" package="WEEE_BIN" value="" x="77.724" y="8.89" rot="MR0"/>
 <element name="U$3" library="oshw" package="OSHW_8MM" value="" x="93.726" y="8.382"/>
diff --git a/hardware/smartcard-fpc/smartcard-fpc.sch b/hardware/smartcard-fpc/smartcard-fpc.sch
index e94329b..41dea84 100644
--- a/hardware/smartcard-fpc/smartcard-fpc.sch
+++ b/hardware/smartcard-fpc/smartcard-fpc.sch
@@ -877,7 +877,7 @@ High volt MLC; no solder stop between for higher isolation</description>
 <part name="X1" library="iso7816-card" deviceset="SMARTCARD" device=""/>
 <part name="FRAME1" library="frames" deviceset="DINA4_L" device=""/>
 <part name="X2" library="laforge" deviceset="FCI_FPC_REBEL_SFW6R-1" device="-JUSHUO-AFA07" value="FCI_FPC_REBEL_SFW6R-1-JUSHUO-AFA07"/>
-<part name="C1" library="rc-sysmocom" deviceset="CAP_CERAMIC" device="_0603"/>
+<part name="C1" library="rc-sysmocom" deviceset="CAP_CERAMIC" device="_0603" value="100n"/>
 </parts>
 <sheets>
 <sheet>