Age | Commit message (Collapse) | Author | Files | Lines | |
---|---|---|---|---|---|
2019-10-01 | Merge branch 'v1.5' | Kévin Redon | 9 | -58447/+58541 | |
Change-Id: I19221ac1e88ee4ba6b74705f898c145fe76724a2 | |||||
2019-10-01 | Merge branch 'v1.4' | Kévin Redon | 19 | -89633/+2587 | |
Change-Id: Ie406e2d62adbd2e9914b04b9d874d2bd520026a9 | |||||
2019-10-01 | Merge branch 'v1.3' | Kévin Redon | 20 | -52855/+136761 | |
Change-Id: I8ecde4dd1b6ff749e762bb2c42f99df04723c753 | |||||
2019-10-01 | Merge branch 'v1.2_production' | Kévin Redon | 11 | -41295/+33883 | |
Change-Id: Ib4cba75e8e3cb795b38db588f6ad452e1ff26faa | |||||
2019-10-01 | Merge branch 'v1.1_production' | Kévin Redon | 11 | -35740/+33718 | |
Change-Id: Ie064c379c9625b3cf6910912fd859e8e4dd0326e | |||||
2019-10-01 | Merge branch 'v1.0_production' | Kévin Redon | 11 | -73337/+49433 | |
Change-Id: I481a6b1802993ceb6d02e7edcbd3b6d853f1e487 | |||||
2015-07-05 | change microcontroller to SAM3S | King Kévin | 9 | -58447/+58541 | |
2014-06-23 | export schematic, and pcb (with minor esthetic corrections) | Kevin Redon | 19 | -87709/+823 | |
2014-06-20 | v1.4: Connect PA0 to 3V3; pull-up for PA1/PA2 (R25,R26) | Harald Welte | 9 | -1651/+1922 | |
PA0, PA1 and PA2 must be high during reset to enter SAM-BA mode. | |||||
2013-10-27 | MCU pin 48 used to identify v1.3 by putting it to ground (with internal pull-up) | Kevin Redon | 9 | -0/+83605 | |
2013-10-27 | exported fabrication files | Kevin Redon | 12 | -51383/+51611 | |
2012-05-18 | RST_PHONE pulldown added on PCB | Kevin Redon | 11 | -2171/+2366 | |
2012-05-16 | v1.2p fabrication exported | Kevin Redon | 11 | -39659/+33659 | |
2012-03-16 | production version of SIM-SAM adapter | Harald Welte | 7 | -0/+1353 | |
2011-12-15 | FFC: add edges of stiffener to Eco1 layer | Harald Welte | 4 | -3/+93 | |
2011-12-14 | FFC: add "sysmocom" text on copper layer of all four adapters | Harald Welte | 3 | -129/+604 | |
2011-12-07 | hw: SIM card is smaller (14.9mm instead of 15mm) to better fit in the slot | Kevin Redon | 3 | -62/+58 | |
2011-11-29 | hw: SIM FFC cables gerber exported. only ppa/paxer kicad could open pcb \!\!\! | Kevin Redon | 3 | -0/+1176 | |
2011-11-05 | hw: sysmocom added to copper, gerber rendered | Kevin Redon | 9 | -831/+1005 | |
2011-11-05 | hw: solder mask between at91sam7s added | Kevin Redon | 11 | -15872/+19667 | |
2011-07-02 | v1.0p corrected and rendered. BOM updatedv1.0_production | Kevin Redon | 11 | -4949/+3602 | |
2011-07-02 | PS/gerber rendered for production | Kevin Redon | 13 | -7635/+8179 | |
2011-07-02 | schema/PCB/gerber output for simcable generated | Kevin Redon | 7 | -0/+1117 | |
2011-07-01 | shema/board/gerber generated. v1.1 released (untested) | Kevin Redon | 13 | -75679/+106736 | |
2011-06-23 | ps/gerber rerendered for the thermal footprints | Kevin Redon | 10 | -98/+2023 | |
2011-06-21 | v1.0 released. board version added, output (schema,gerber) rendered | Kevin Redon | 12 | -37961/+76848 | |
2011-06-21 | output rendered | Kevin Redon | 12 | -44915/+33798 | |
2011-05-22 | debug port changed | Kevin Redon | 6 | -4374/+3978 | |
2011-05-17 | board rerouted | Kevin Redon | 6 | -101251/+54423 | |
2011-05-15 | pcb drawings & gerber added | Kevin Redon | 5 | -0/+107083 | |